Thursday, July 16th, 2026

Samsung to unveil record $650 billion South Korea investment amid AI boom



SEOUL: Samsung Electronics is expected to announce a record 1,000 trillion won (approximately $650 billion) domestic investment plan next week, underscoring its long-term commitment to artificial intelligence (AI)-driven semiconductor growth.

According to South Korean media reports, the investment package will be unveiled jointly by Samsung and the government during a “National Mega Project” briefing on Monday, hosted by President Lee Jae Myung.

The initiative aligns with Lee’s strategy to accelerate economic development in regions beyond the capital, Seoul.

Fellow chipmaker SK hynix is also expected to announce new investment plans at the same event.

Both companies are global leaders in advanced memory chips used in data centres that power artificial intelligence applications, including chatbots and image-generation tools.

The proposed 10-year investment package is expected to include around 300 trillion won for a new semiconductor complex in southwestern South Korea, a region that has lagged behind Seoul in technology investment.

Reports also suggest that about 60 trillion won will be allocated to six semiconductor fabrication plants in Yongin, while more than 350 trillion won will be invested in AI infrastructure, including data centres.

If confirmed, the package would represent the largest investment commitment ever announced by a South Korean company.

President Lee recently met Samsung Chairman Lee Jae-yong in Seoul to discuss semiconductor investments. He also reportedly held talks with SK Group Chairman Chey Tae-won last week.

Samsung reported an operating profit of 43.6 trillion won last year, marking a 33 percent increase from the previous year, driven largely by surging demand for AI-related semiconductors.

Presidential Chief of Staff for Policy Kim Yong-beom said discussions on the planned Yongin semiconductor project are in their final stages and that the government intends to present the full plan jointly with participating companies once all details are finalized.

Publish Date : 26 June 2026 21:25 PM

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